We offer vertically integrated processing capabilities—from electroplating, adhesive coating, and lamination to precision die-cutting and wrapping—to support the mass production and customized processing of EMI shielding materials such as conductive fabric, copper foil, and conductive foam.
With a monthly production capacity exceeding 900,000 square meters, our automated coating, slitting, and die-cutting lines enable rapid delivery of EMI materials in various thicknesses, adhesive types, and structural formats. These materials are widely used in smartphones, servers, automotive modules, connectors, and high-frequency signal transmission interfaces.
Through efficient processing and integrated module bonding, we help customers reduce assembly complexity, enhance structural reliability, and achieve the optimal balance between thin-profile design and shielding performance.